William Eugene Runstadler, Jr

Title: **William Eugene Runstadler, Jr.: Innovator in Substrate Fabrication**

Introduction

William Eugene Runstadler, Jr. is a notable inventor based in Livermore, California, who has made significant contributions to the field of substrate fabrication. With a portfolio that includes five patents, Runstadler has demonstrated a commitment to innovation in semiconductor technology.

Latest Patents

Among his recent work are two groundbreaking patents. The first, titled "Wafer plate and mask arrangement for substrate fabrication," describes a sophisticated system designed for processing wafers within a vacuum processing chamber. This invention encompasses a carrier that features a frame with multiple openings, each tailored to hold a wafer. Additionally, it incorporates an advanced transport mechanism for moving multiple carriers throughout the system, alongside a series of wafer plates engineered to support the wafers securely. The attachment mechanism intricately connects the wafer plates to the carriers, ensuring precise positioning during processing.

Another innovative patent focuses on a "System of height and alignment rollers for precise alignment of wafers for ion implantation." This invention differentiates the tasks of transporting substrates and aligning them both vertically and horizontally with remarkable accuracy. The transport system utilizes a carriage equipped with various pedestals and precision alignment wheels, providing excellent stability and guiding the substrates to their accurate placement.

Career Highlights

William Eugene Runstadler, Jr. currently works at Intevac, Inc., where he plays a vital role in the development of semiconductor manufacturing technologies. Through his inventive work, Runstadler has significantly contributed to advancing the capabilities of semiconductor processing equipment.

Collaborations

In his professional journey, Runstadler has collaborated with renowned colleagues, including Terry Bluck and Terry Pederson. These partnerships reflect a synergy of innovation and expertise, further enhancing the impact of their combined efforts on the industry.

Conclusion

William Eugene Runstadler, Jr.’s contributions to the field of substrate fabrication exemplify the spirit of innovation. His patents not only enhance semiconductor processing technologies but also pave the way for future advancements in the industry. As he continues to work at Intevac, Inc., the ongoing influence of his inventions will undoubtedly play a crucial role in shaping the future of semiconductor engineering.