This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 1999.
Company Filing History:
Years Active: 1999
Title: William David Darlington: Innovator in Semiconductor Technology
Introduction
William David Darlington is a notable inventor based in Leander, Texas. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work has implications for the efficiency and effectiveness of semiconductor devices.
Latest Patents
Darlington holds a patent for a "Process for forming a semiconductor device." This patent describes a method for creating via openings between two aluminum-containing interconnects. The process involves removing a veil material formed during the etching of an insulating layer. The veil material is eliminated through a combination of a first dry etch and exposure to an aqueous organic solvent. The first dry etch utilizes oxygen-containing and fluorine-containing gases, performed during the resist removal phase. This method effectively removes the veil without damaging the insulating layer or the underlying aluminum interconnect. Additionally, the temperature of the aqueous organic solvent can be reduced, which decreases volatile organic compound emissions while maintaining solvent strength.
Career Highlights
William David Darlington is associated with Motorola Corporation, where he has applied his expertise in semiconductor technology. His work at Motorola has allowed him to contribute to advancements in electronic devices and systems.
Collaborations
Throughout his career, Darlington has collaborated with notable colleagues, including Freddie Cumpian and Wesley Phillip Graff. These collaborations have fostered innovation and development in the semiconductor field.
Conclusion
William David Darlington's contributions to semiconductor technology through his patent demonstrate his commitment to innovation. His work continues to influence the industry and improve the efficiency of semiconductor devices.
