Santa Rosa, Philippines

William Cabreros

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Stmicroelectronics Gmbh. Active years: 2013-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Cabreros. Retrieved from https://idiyas.com/inventor/william-cabreros

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Calamba, PH (2013)
  • Sta Rosa, PH (2015)

Company Filing History:


Years Active: 2013-2015

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of William Cabreros

Introduction

William Cabreros is a notable inventor based in Sta. Rosa, Philippines. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

Cabreros' latest patents include a leadless semiconductor package and method of manufacture. This invention features a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During the manufacturing process, molding compound is deposited over a face of the leadframe where the die paddle and bond pads are positioned. After curing the molding compound, the back side of the leadframe is etched to isolate the die paddle and bond pads, ensuring that the back surfaces remain exposed at the back face of the body.

Another significant patent by Cabreros is the leadless semiconductor package with routable leads and method of manufacture. This package also includes a package body on a leadframe, featuring a die paddle and a plurality of high-aspect-ratio leads. Each lead is coupled at one end to a contact pad of the package and at the other end to a semiconductor die mounted on the die paddle. Similar to his previous invention, molding compound is deposited over the leadframe, and after curing, the back side is etched to isolate the die paddle and leads, with back surfaces remaining exposed.

Career Highlights

William Cabreros is currently employed at STMicroelectronics GmbH, where he continues to innovate in the semiconductor industry. His work has contributed to advancements in packaging technology, enhancing the performance and reliability of semiconductor devices.

Collaborations

Cabreros collaborates with his coworker, Jerry Tan, to further develop innovative solutions in their field. Their teamwork exemplifies the importance of collaboration in driving technological advancements.

Conclusion

William Cabreros is a distinguished inventor whose contributions to semiconductor packaging have made a significant impact in the industry. His patents reflect his commitment to innovation and excellence in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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