Company Filing History:

12 out of 7,642

Sun Microsystems, Inc.

patents

2 out of 11,294

Oracle International Corporation

patents

1 out of 2,297

Digital Equipment Corporation

where one patent can have more than one assignee

Years Active: 1992-2019

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10368461 - System for electrical connection of printed circuit boards and backplanes in server enclosure (2019-07-30),

2. 10111356 - System for electrical connection of printed circuit boards and backplanes in server enclosure (2018-10-23),

3. 6927968 - Security mechanism for a network device (2005-08-09),

4. 6639807 - Card retention mechanism (2003-10-28),

5. 6437992 - Hot pluggable printed circuit board insulating system and method (2002-08-20),

6. 6239592 - Test fixture with quick connect and release board interconnect mechanism (2001-05-29),

7. 6141213 - Computer with high airflow and low acoustic noise (2000-10-31),

8. D425495 - Cabinet for electronic equipment such as a computer system (2000-05-23),

9. 5957465 - Modular EMC PCI card gasket (1999-09-28),

10. 5927389 - Fan tray guide and isolation mount and method (1999-07-27),

11. 5911596 - Strain relief apparatus and methods therefor (1999-06-15),

12. 5867369 - Rugged computer housing (1999-02-02),

13. 5839584 - Motherboard stiffener and guide for processor modules and PCI cards (1998-11-24),

14. 5579212 - Protective cover for a silicon chip device and method relating thereto (1996-11-26),

15. 5400214 - Brackets and levers for installing and maintaining motherboards in (1995-03-21),

Title: Innovations of William A Izzicupo

Introduction

William A Izzicupo is a notable inventor based in Windham, NH (US), recognized for his contributions to electrical engineering and printed circuit board technology. He holds a total of 17 patents, showcasing his innovative spirit and technical expertise in the field.

Latest Patents

One of his latest patents is a system for the electrical connection of printed circuit boards and backplanes in server enclosures. This invention focuses on utilities designed to reduce or eliminate gaps between the tips of male pins and the bottoms of corresponding female sockets in interfaced connectors. The technology addresses the challenges posed by varying mechanical tolerances in server enclosures and computing modules. The disclosed utilities enhance signal quality and data rates through these connectors while minimizing strain on the printed circuit board and solder joints during the interfacing process.

Career Highlights

Throughout his career, William has worked with prominent companies such as Sun Microsystems, Inc. and Oracle International Corporation. His experience in these organizations has significantly contributed to his development as an inventor and innovator in the technology sector.

Collaborations

William has collaborated with notable professionals in his field, including Robert S Antonuccio and James M Carney. These collaborations have likely enriched his work and led to further advancements in his inventions.

Conclusion

William A Izzicupo's innovative contributions to electrical engineering and printed circuit board technology have made a significant impact in the industry. His patents reflect a commitment to improving the quality and efficiency of electronic connections.

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