Will Findlay

Title: **Innovations of Will Findlay: Pioneering Flexible Hybrid Interconnect Circuits**

Introduction

Will Findlay, an esteemed inventor based in San Carlos, California, holds an impressive portfolio of 12 patents. His work primarily revolves around advancing flexible hybrid interconnect circuits, showcasing his significant contributions to the field of electronics.

Latest Patents

Among his latest inventions, Findlay has focused on flexible hybrid interconnect circuits. This innovative circuit technology features multiple conductive layers that are stacked and spaced apart, allowing for enhanced functionality. Each conductive layer includes various elements, with specific components designed to operate as high-frequency (HF) signal lines. The design also incorporates electromagnetic shielding around these signal lines, ensuring optimal performance. Notably, some elements facilitate electrical power transmission, contributing to the circuit's versatility. The structure remains thin and flexible, enabling it to conform to non-planar surfaces. His methods involve layering metal sheets and dielectric materials to fabricate these advanced circuits.

Another significant innovation is his work on flexible interconnect circuit assemblies. These circuits consist of multiple monolithically integrated circuit portions. During fabrication, some portions are strategically folded to create stacks, subsequently unfolded into their final form. This inventive approach allows for efficient use of materials and enhances the overall design flexibility. Additionally, these assemblies may incorporate bonding films and temporary support films, ensuring that circuit portions are secure and optimally positioned.

Career Highlights

Will Findlay's journey as an inventor is marked by a dedication to pushing the boundaries of technology through his inventions. His innovative spirit and technical expertise have made him a valuable contributor in the electronics field. As part of Cellink Corporation, he continues to influence advancements in innovative circuit designs.

Collaborations

Throughout his career, Findlay has collaborated with notable colleagues, including Kevin Michael Coakley and Malcolm Parker Brown. These partnerships have further enriched his work and contributed to the development of groundbreaking technologies in flexible interconnect circuits.

Conclusion

In summary, Will Findlay's inventive prowess and dedication to developing flexible hybrid interconnect circuits significantly advance the electronics landscape. As he continues his work with Cellink Corporation, his contributions promise to shape the future of this vital industry.