This inventor holds 1 USPTO granted patent. Top assignee: Fairchild Semiconductor Corporation. Active years: 1987.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1987
Title: Innovations by Wilbert E Daniels
Introduction
Wilbert E Daniels is a notable inventor based in West Buckston, ME (US). He has made significant contributions to the field of integrated circuit packaging. His innovative designs have paved the way for advancements in electronic components.
Latest Patents
Wilbert E Daniels holds a patent for a "Low impedance package for integrated circuit die." This invention features a low inductive impedance dual in-line package that incorporates a lead frame with a central opening. The design eliminates the need for a die attach paddle and includes a ground plate that forms the die attach plane. This configuration minimizes inductive impedance to ground current and reduces cross coupling between the lead fingers. The invention is particularly applicable to dual in-line packages (DIPs) and enhances technology for high-speed low inductance applications.
Career Highlights
Wilbert E Daniels is associated with Fairchild Semiconductor Corporation, where he has contributed to various projects and innovations. His work has been instrumental in developing advanced packaging solutions for integrated circuits.
Collaborations
Wilbert has collaborated with Dana J Fraser, working together to enhance the capabilities of integrated circuit packaging.
Conclusion
Wilbert E Daniels is a distinguished inventor whose work in low impedance packaging has significantly impacted the electronics industry. His innovative designs continue to influence the development of high-speed electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile