Company Filing History:
Years Active: 2003
Title: Wi William Lee: Innovator in Thermal Stress Testing
Introduction
Wi William Lee is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor testing, particularly through his innovative patent that enhances the efficiency of thermal stress testing.
Latest Patents
Wi William Lee holds a patent for an "Accelerated Thermal Stress Cycle Test." This invention allows for a significantly reduced test time compared to conventional methods. The test is conducted in a cluster of reaction chambers, including a CVD chamber and a cool-down chamber. A pre-processed wafer can be heated from room temperature to at least 350°C in an inert gas in about 2 minutes. It can then be cooled down to not higher than 70°C in less than 30 seconds. The heating and cooling steps can be repeated between 3 and 7 times to reveal any defect formation caused by the thermal stress cycle test. Typical defects include metal film peeling from insulating dielectric material layers or void formation.
Career Highlights
Wi William Lee is associated with Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing testing methodologies that improve product reliability and performance.
Collaborations
Wi William Lee has collaborated with notable colleagues, including Ying-Chen Chao and Sen-Shan Yang. Their combined efforts contribute to the innovative environment at Taiwan Semiconductor Manufacturing Company Limited.
Conclusion
Wi William Lee's contributions to thermal stress testing represent a significant advancement in semiconductor technology. His innovative approach not only enhances testing efficiency but also improves the reliability of semiconductor products.