This inventor holds 4 USPTO granted patents. Top assignee: U.S. Philips Corporation. Active years: 1995-2001.
Company Filing History:
Years Active: 1995-2001
Title: Wessel J Wesseling: Innovator in Component Placement Technology
Introduction
Wessel J Wesseling is a notable inventor based in Eindhoven, Netherlands. He has made significant contributions to the field of component placement technology, holding a total of 4 patents. His work focuses on improving the efficiency and effectiveness of processes related to printed circuit boards.
Latest Patents
Wesseling's latest patents include a "Component placement machine" and a "Method of soldering components to at least one carrier." The component placement machine features a frame and a transport device designed for transporting printed circuit boards in an X-direction. This transport device is equipped with a transport belt that has an outer surface where printed circuit boards are positioned. The design ensures that an edge portion of the printed circuit board is retained between the transport belt's outer surface and the frame's contact surface during both transport and component placement.
The method of soldering components involves connecting components to a carrier, such as a flexible foil, within an oven. This oven is divided into upper and lower parts, each with distinct hot air streams. The separation by the foil allows for different temperatures in each part, enabling rapid adjustments to the desired temperature at the location of the carriers.
Career Highlights
Wessel J Wesseling is associated with U.S. Philips Corporation, where he has contributed to various innovative projects. His expertise in component placement technology has positioned him as a key figure in the advancement of manufacturing processes.
Collaborations
Wesseling has collaborated with notable coworkers, including Nicolaas J Van Veen and Gerardus L J Reuvers. Their combined efforts have led to significant advancements in their respective fields.
Conclusion
Wessel J Wesseling's contributions to component placement technology and soldering methods highlight his innovative spirit and dedication to improving manufacturing processes. His patents reflect a commitment to enhancing efficiency in the electronics industry.