This inventor holds 1 USPTO granted patent. Top assignee: Chartered Semiconductor Manufacturing Ltd (Corporation). Active years: 2007.
Company Filing History:
Years Active: 2007
Title: The Innovations of Weoi San Lok in Semiconductor Technology
Introduction
Weoi San Lok is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. With a focus on high density plasma processes, his innovations aim to improve the quality and reliability of plasma films used in various applications.
Latest Patents
Weoi San Lok holds a patent titled "Method for Reducing Argon Diffusion from High Density Plasma Films." This patent describes a two-step high density plasma-CVD (Chemical Vapor Deposition) process that controls the argon content in the film by utilizing varying argon concentrations in the argon/silane/oxygen gas mixture. The first step involves a high argon concentration and low sputter etch-to-deposition (E/D) ratio, which effectively maintains the gap openings without necking. In the second step, a lower argon concentration and reduced E/D ratio are applied to minimize metal defects caused by argon diffusion in the top layers of the HDP-CVD film.
Career Highlights
Weoi San Lok has made significant strides in his professional career, working at Chartered Semiconductor Manufacturing Ltd, a leading corporation in the semiconductor industry. His innovative research and developments have paved the way for advancements in plasma film technology, showcasing his expertise and dedication to improving semiconductor manufacturing processes.
Collaborations
Throughout his career, Weoi San Lok has collaborated with esteemed colleagues such as Jun Xie and Hoon Lian Yap. Working alongside these talented professionals has allowed him to enhance his research capabilities and share valuable insights into semiconductor advancements.
Conclusion
Weoi San Lok's contributions to the field of semiconductor technology, especially through his patented methods, exemplify the importance of innovation in manufacturing processes. His work not only addresses critical industry challenges but also sets the stage for future innovations in high density plasma applications.