Shenzhen, China

Wenjun Luo

This inventor holds 4 USPTO granted patents and 5 published patent applications and 5 EPO patents. Top assignee: Honor Device Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenjun Luo. Retrieved from https://idiyas.com/inventor/wenjun-luo-jbklrug0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.3

ph-index = 1


Company Filing History:


Years Active: 2025

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Wenjun Luo

Introduction

Wenjun Luo is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of electronic devices and circuit board technology. With a total of 4 patents to his name, Luo continues to push the boundaries of innovation in his industry.

Latest Patents

Luo's latest patents include a circuit board assembly and an electronic device. The embodiments of this application provide a circuit board assembly that includes a first circuit board and a second circuit board stacked with the first circuit board. The first circuit board is equipped with a first shielding frame on a surface facing the second circuit board, while the second circuit board has a second shielding frame on a surface facing the first circuit board. The opposite end portions of the first and second shielding frames are connected to a shared shielding cover, enclosing a shielding cavity.

Another notable patent is the circuit board assembly soldering apparatus and corresponding method. This application describes a soldering apparatus that features at least two bearing seats on a base plate. The bearing seats are located in a space between the base plate and a pressing plate assembly, with each bearing seat including a workbench. The workbench is positioned on the side of the bearing seat that faces the pressing plate assembly, allowing a circuit board assembly to be placed on it. The apparatus is designed to connect at least two circuit board assemblies by soldering at a single time, accommodating different thicknesses.

Career Highlights

Wenjun Luo is currently employed at Honor Device Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic devices and circuit board assemblies.

Collaborations

Luo collaborates with talented individuals such as Jianqiang Guo and Liang Zhang, contributing to a dynamic and innovative work environment.

Conclusion

Wenjun Luo's contributions to the field of electronics and circuit board technology are noteworthy. His innovative patents and collaborative efforts highlight his commitment to advancing technology in meaningful ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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