The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Sep. 14, 2022
Honor Device Co., Ltd., Shenzhen, CN;
Honor Device Co., Ltd., Shenzhen, CN;
Abstract
This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.