Wen Xiao

Title: Wen Xiao and Advances in Material Bonding

Introduction

Wen Xiao is an inventor based in San Jose, California, whose patent work addresses methods for preparing material surfaces for stronger bonding. Xiao is associated with Applied Materials, Inc., a company that develops materials engineering solutions.

Latest Patents

The provided information lists one patent for Xiao: “Apparatus and Methods for Bonding Materials.” The invention describes a surface-preparation method that uses multiple plasma treatments to increase bonding strength. It applies a first treatment using capacitively coupled plasma (CCP), or a simultaneous combination of CCP and inductively coupled plasma (ICP), to promote diffusion into the material surface. A diffusion layer is then formed on the surface, followed by a second CCP treatment to increase diffusion of that layer into the material. A third treatment uses ICP, or a simultaneous combination of CCP and ICP, to form dangling bonds on the diffusion layer. The listed patent count is 1 patent.

Career Highlights

Xiao’s documented invention focuses on controlling surface properties through sequential plasma processes. By combining diffusion-layer formation with additional plasma treatments, the method aims to improve the interface between materials being bonded.

Collaborations

The provided information identifies Ming-Jui Li and Michelle Tjakradinata as Xiao’s coworkers. It does not specify their roles in the patent or describe particular collaborative contributions.

Conclusion

Wen Xiao’s listed patent presents a multi-stage plasma approach to preparing material surfaces for bonding, reflecting a focused contribution to materials engineering at Applied Materials, Inc.