The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Dec. 18, 2023
Applied Materials, Inc., Santa Clara, CA (US);
Wen Xiao, San Jose, CA (US);
Ming-Jui Li, Sunnyvale, CA (US);
Michelle Tjakradinata, San Jose, CA (US);
Harish Varma Penmethsa, Dublin, CA (US);
Jeffrey Ivan Turner, Kalispell, MT (US);
Applied Materials Inc., Santa Clara, CA (US);
Abstract
A method for preparing a surface for bonding leverages multiple treatment processes to increase bonding strength. The method may include performing a first treatment process on a surface of a material using a first plasma process to promote diffusion into the first surface of a diffusion layer deposited after the first treatment process where the first treatment process uses capacitively coupled plasma (CCP) or a combination including both CCP and inductively coupled plasma (ICP) simultaneously, forming the diffusion layer on the surface of the material, performing a second treatment process using a second plasma process to increase diffusion of the diffusion layer into the surface of the material where the second treatment process uses CCP, and performing a third treatment process using a third plasma process to form dangling bonds on the diffusion layer where the third treatment process uses ICP or a combination including both CCP and ICP simultaneously.