Sungai Petani, Malaysia

Wen Wei Lum

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2020-2021

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4 patents (USPTO):

Title: Innovations by Wen Wei Lum

Introduction

Wen Wei Lum is a notable inventor based in Sungai Petani, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work primarily focuses on advanced packaging techniques for integrated circuits.

Latest Patents

Wen Wei Lum's latest patents include innovative designs that enhance the functionality and efficiency of semiconductor devices. One of his notable patents is for "Packaged die stacks with stacked capacitors and methods of assembling same." This invention features a vertically arranged package of stacked capacitors that can be electrically coupled to one or more semiconductive devices. Another significant patent is the "Over-molded IC package with in-mold capacitor." This design incorporates an IC chip or die coupled to a metal distribution layer, with capacitors embedded within a molding compound, enhancing the overall performance of the package.

Career Highlights

Wen Wei Lum is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing new packaging solutions that improve the integration and performance of electronic devices.

Collaborations

Wen Wei Lum collaborates with talented individuals in his field, including coworkers Bok Eng Cheah and Mooi Ling Chang. Their combined expertise contributes to the innovative projects at Intel Corporation.

Conclusion

Wen Wei Lum's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in electronic packaging solutions.

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