Wen-Tung Chuang

Title: Innovations by Inventor Wen-Tung Chuang

Introduction

Wen-Tung Chuang is an innovative inventor based in Hsinchu County, Taiwan. She has made significant contributions to the field of semiconductor structures, focusing on advanced fabrication methods. Although she currently holds no granted patents, her work in developing new technologies is noteworthy.

Latest Patent Applications

Wen-Tung Chuang's latest patent applications include two significant innovations. The first application is titled "SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS." This application describes semiconductor structures and fabrication methods that involve forming a first dielectric layer on a semiconductor structure, which includes a substrate and a multi-layer interconnect (MLI) structure. The method outlines the formation of a through-substrate-via (TSV) opening and the subsequent processes to create multiple first metal vias and lines, culminating in the formation of first metal capping layers.

The second application is titled "SEMICONDUCTOR STRUCTURES WITH COVER LAYERS." This application details semiconductor structures that include a die with a test pad featuring a probe mark. The structure is enhanced by the inclusion of first and second cover layers made from different materials, which are disposed on the test pad and its probe mark.

Conclusion

Wen-Tung Chuang's innovative work in semiconductor technology showcases her commitment to advancing the field. Her latest patent applications reflect her expertise and potential for future contributions to the industry.