Company Filing History:
Years Active: 2020-2023
Title: Innovations by Wen-Ti Cheng in Heat Dissipation Technology.
Introduction
Wen-Ti Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 4 patents. His work focuses on innovative methods and devices that enhance the efficiency of heat management in various applications.
Latest Patents
One of his latest patents is titled "Heat dissipation plate and method for manufacturing the same." This invention describes a heat dissipation device that includes a first plate with a first plurality of angled grooves arranged in a specific direction, and a second plate with a second plurality of angled grooves arranged similarly. The two plates are coupled together, allowing portions of the grooves to connect and define a fluid channel that includes coolant. Additionally, the device features at least one capillary structure that covers part of the fluid channel, enhancing its heat dissipation capabilities. Another patent under his name outlines a method for manufacturing such a heat dissipation device, which involves stamping a composite plate, depositing powder, and welding the plates together to create a capillary structure.
Career Highlights
Wen-Ti Cheng is currently employed at Cooler Master Co., Ltd., a company renowned for its innovative cooling solutions. His work at Cooler Master has allowed him to apply his inventive skills in practical applications, contributing to the advancement of thermal management technologies.
Collaborations
Wen-Ti Cheng collaborates with Wei-Lung Chan, a talented woman in the field. Their partnership exemplifies the importance of teamwork in driving innovation and achieving successful outcomes in their projects.
Conclusion
Wen-Ti Cheng's contributions to heat dissipation technology through his patents and work at Cooler Master Co., Ltd. highlight his role as a key innovator in the industry. His inventions not only improve heat management but also pave the way for future advancements in thermal solutions.