The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
May. 24, 2019
Applicant:
Cooler Master Co., Ltd., New Taipei, TW;
Inventors:
Wei-Lung Chan, New Taipei, TW;
Wen-Ti Cheng, New Taipei, TW;
Assignee:
COOLER MASTER CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28F 3/12 (2006.01); B21D 53/04 (2006.01); F28F 3/14 (2006.01); B23P 15/26 (2006.01); F28D 15/02 (2006.01); B23K 101/14 (2006.01); B21D 39/03 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); B21D 53/04 (2013.01); B23P 15/26 (2013.01); F28F 3/12 (2013.01); F28F 3/14 (2013.01); B21D 39/031 (2013.01); B23K 2101/14 (2018.08); F28D 2015/0216 (2013.01); F28F 2255/06 (2013.01); F28F 2255/08 (2013.01); F28F 2255/18 (2013.01); F28F 2275/06 (2013.01); Y10T 29/49368 (2015.01);
Abstract
A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.