Wen-Teng Wu

Title: Innovations of Wen-Teng Wu

Introduction

Wen-Teng Wu is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

One of his latest patents is a "Test carrier for attaching a semiconductor device." This invention describes a method for forming a semiconductor test carrier that includes an insulating substrate with a rectangular cavity. The cavity is designed to accommodate a semiconductor device, which is adhesively bonded to a glass plate attached to the substrate. The patent outlines the intricate details of conductive traces and wire bond pads that facilitate the connection of the device to the substrate.

Another significant patent is the "Bond pad structure for the via plug process." This invention provides a reliable bond pad structure that ensures effective interconnections between the bond pad and the next level of circuit integration. The design features three metal pads separated by dielectric layers, with diamond-shaped via plugs formed between them, enhancing the overall reliability of the semiconductor device.

Career Highlights

Wen-Teng Wu is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His innovative work has contributed to the advancement of semiconductor technologies, making a lasting impact on the field.

Collaborations

Wen-Teng has collaborated with several talented individuals, including Ruey-Yun Shiue and Pi-Chen Shieh. Their teamwork has fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Wen-Teng Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor devices and their applications.