Taipei, Taiwan

Wen-Sung Tsou

This inventor holds 1 USPTO granted patent. Top assignee: Nan Ya Technology Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Sung Tsou. Retrieved from https://idiyas.com/inventor/wen-sung-tsou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Wen-Sung Tsou: Patent Activity in Vertical Memory Devices.

Introduction

Wen-Sung Tsou is an inventor associated with Taipei, Taiwan. The provided information identifies one patent for Tsou and lists Nan Ya Technology Corporation as the company he works for.

Latest Patents

Tsou’s patent, “Method of Forming Conductive Stud on Vertical Memory Device,” describes a process for forming a conductive stud. The method fills an opening in a substrate, which exposes part of a vertical memory device, with a conductive layer. Chemical mechanical polishing then shapes the layer into a stud whose upper surface is substantially below the substrate’s upper surface. Tsou is credited with 1 patent in the supplied data.

Career Highlights

The available information connects Tsou’s patent work with Nan Ya Technology Corporation and semiconductor memory-device fabrication. No additional career details were provided.

Collaborations

Chia-Sheng Yu and Shian-Jyh Lin are listed as Tsou’s coworkers. The supplied information does not specify their roles in the patent.

Conclusion

Wen-Sung Tsou’s listed patent focuses on a conductive-stud formation method for vertical memory devices, reflecting work in semiconductor manufacturing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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