Wen-Sung Hsu

Title: Innovations by Wen-Sung Hsu in Semiconductor Packaging

Introduction

Wen-Sung Hsu is a notable inventor based in San Diego, CA, who has made significant contributions to the field of semiconductor packaging. His innovative work focuses on enhancing the efficiency and reliability of semiconductor package assembly systems.

Latest Patents

Wen-Sung Hsu holds a patent for a groundbreaking invention titled "Semiconductor package assembly systems and methods using DAM and trench structures." This patent describes a packaging system designed to prevent underfill overflow. The system includes a package substrate with a solder mask, a die attach site, a solder mask dam located proximal to the die attach site, and a trench in the solder mask. The trench and solder mask dam work together to effectively constrain the flow of underfill material, ensuring a more reliable assembly process. He has 1 patent to his name.

Career Highlights

Wen-Sung Hsu is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His role at Qualcomm allows him to apply his expertise in semiconductor packaging, contributing to the development of advanced technologies.

Collaborations

Wen-Sung has collaborated with Ruey Kae Zang, a talented woman in the field, to further enhance their projects and innovations in semiconductor packaging.

Conclusion

Wen-Sung Hsu's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology in this critical field. His work at Qualcomm Incorporated continues to influence the industry positively.