The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Nov. 19, 2009
Applicants:
Ruey Kae Zang, San Diego, CA (US);
Wen-sung Hsu, San Diego, CA (US);
Inventors:
Ruey Kae Zang, San Diego, CA (US);
Wen-Sung Hsu, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A packaging system for preventing underfill overflow includes a package substrate having a solder mask a die attach site, a solder mask dam on the solder mask proximal to the die attach site, and a trench in the solder mask proximal to the die attach site. The trench and the solder mask dam are adapted to constrain flow of an underfill material.
Zang, Ruey. (2015). Semiconductor package assembly systems and methods using dam and trench structures (U.S. Patent No. 8952552). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8952552
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile