Location History:
- Taoyuan, TW (2010)
- Zhongli, TW (2010)
Company Filing History:
Years Active: 2010
Title: Innovations by Inventor Wen-Shin Lin
Introduction
Wen-Shin Lin is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative mounting methods for passive components. With a total of 2 patents, Lin's work has enhanced the efficiency and reliability of electronic devices.
Latest Patents
One of Lin's latest patents is a "Mounting Method of Passive Component." This invention addresses the challenges associated with mounting small-size passive components. The method involves using an adhesive material that is melted and solidified to create a fixing structure between the passive component and a substrate. This approach effectively resolves the tombstone problem caused by uneven pulling forces during soldering, thereby increasing yield rates and reducing product loss.
Another significant patent is the "Surface Mounting Method." This improved method is applied in semiconductor package processes. It includes steps such as providing a substrate with pads, setting a mask with openings, and conducting a printing process to form a conductive layer. After removing the mask, a passive device is placed on the conductive layer, followed by a heating treatment to secure the device to the pad.
Career Highlights
Wen-Shin Lin is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in improving manufacturing processes and product quality.
Collaborations
Lin collaborates with talented coworkers, including Wei-Chih Wang and Pai-Chou Liu. Their combined expertise contributes to the advancement of semiconductor technologies and the development of innovative solutions.
Conclusion
Wen-Shin Lin's contributions to semiconductor packaging through his innovative patents demonstrate his commitment to enhancing electronic device performance. His work not only addresses existing challenges but also paves the way for future advancements in the industry.