The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7662709 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 16, 2010

Filed:

Dec. 28, 2006
Applicants:

Pai-chou Liu, Kaohsiung, TW;

Wen-shin Lin, Zhongli, TW;

Sheng-hong Cheng, Kaohsiung, TW;

Yu-hsin Lee, Kaohsiung, TW;

Ming-chia Hsieh, Changhua County, TW;

Kuan-hung Yeh, Penghu County, TW;

Chia-wei Chang, Pingtung, TW;

Tsung-chi Chen, Tainan County, TW;

Inventors:

Pai-Chou Liu, Kaohsiung, TW;

Wen-Shin Lin, Zhongli, TW;

Sheng-Hong Cheng, Kaohsiung, TW;

Yu-Hsin Lee, Kaohsiung, TW;

Ming-Chia Hsieh, Changhua County, TW;

Kuan-Hung Yeh, Penghu County, TW;

Chia-Wei Chang, Pingtung, TW;

Tsung-Chi Chen, Tainan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.


Find Patent Forward Citations

Liu, Pai-Chou. (2010). Surface mounting method (U.S. Patent No. 7662709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7662709

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