Shenzhen, China

Wen-Hu Chen


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovations of Wen-Hu Chen in Heat Pipe Technology

Introduction

Wen-Hu Chen is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of thermal management through his innovative designs in heat pipe technology. His work has been recognized for its practical applications in various industries.

Latest Patents

Wen-Hu Chen holds a patent for a heat pipe that includes a main wick structure and at least one auxiliary wick structure. This heat pipe consists of a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained within the casing. The main wick structure is attached to the inner surface of the casing, while the inner peripheral surface of the main wick structure and the outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow and extends along the longitudinal direction of the casing, with a liquid channel defined within it. Both ends of the auxiliary wick structure are fixed to the ends of the casing, ensuring that the working fluid is saturated in both the main and auxiliary wick structures.

Career Highlights

Throughout his career, Wen-Hu Chen has worked with prominent companies such as Furui Precise Component (Kunshan) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Wen-Hu Chen has collaborated with talented individuals in his field, including Sheng-Lin Wu and Yu-Liang Lo. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Wen-Hu Chen's contributions to heat pipe technology exemplify the importance of innovation in thermal management solutions. His patent and collaborations highlight his commitment to advancing the field and improving efficiency in various applications.

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