This inventor holds 1 USPTO granted patent. Top assignee: Vanguard International Semiconductor Corporation. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Innovations of Wen-Hsien Liu in Semiconductor Technology
Introduction
Wen-Hsien Liu is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative approaches have led to advancements in semiconductor device fabrication methods.
Latest Patents
Wen-Hsien Liu holds a patent for a semiconductor device fabricating method. This method involves providing a substrate and forming a first gate insulating layer and a second gate insulating layer on the substrate. A gate layer is blanketly formed, and portions of the gate layer and insulating layers are removed to create a first gate and a second gate. The remaining insulating layers have specific thickness ratios, which are crucial for the device's performance.
Career Highlights
Wen-Hsien Liu is associated with Vanguard International Semiconductor Corporation, where he applies his expertise in semiconductor fabrication. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor devices.
Collaborations
Wen-Hsien Liu has collaborated with notable colleagues, including Chih-Ping Lin and Shih-Ming Chen. These collaborations have fostered a productive environment for innovation and development in semiconductor technologies.
Conclusion
Wen-Hsien Liu's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patent and work at Vanguard International Semiconductor Corporation highlight his role as a key player in advancing semiconductor device fabrication methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile