Wen-Home Huang

Title: Innovations of Wen-Home Huang in Semiconductor Packaging

Introduction

Wen-Home Huang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approaches. His work focuses on enhancing the structural integrity and bonding of semiconductor packages.

Latest Patents

Wen-Home Huang's latest patents include a fabrication method of semiconductor packages. This method involves several steps, such as providing a semiconductor chip with an active surface and a non-active surface. The process includes roughening a peripheral portion of the non-active surface, which divides it into a roughened structure and a non-roughened central portion. The semiconductor chip is then mounted on a chip carrier using solder bumps on the active surface. An encapsulant is formed on the chip carrier to encapsulate the semiconductor chip. The roughened structure enhances the bonding between the chip and the encapsulant, while the non-roughened central portion maintains the chip's structural strength.

Career Highlights

Wen-Home Huang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative techniques in semiconductor packaging. His contributions have been instrumental in advancing the technology used in this field.

Collaborations

Wen-Home Huang collaborates with talented individuals such as Wen-Tsung Tseng and Chang-Fu Lin. These collaborations have fostered a creative environment that encourages the development of new ideas and solutions in semiconductor technology.

Conclusion

Wen-Home Huang's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor technology.