Wen-Hao Lee

Title: Innovations of Inventor Wen-Hao Lee

Introduction

Wen-Hao Lee is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on enhancing the efficiency and reliability of light-emitting elements and semiconductor packages.

Latest Patents

One of his latest patents is titled "Package having light-emitting element and fabrication method thereof." This invention includes a substrate with a light-emitting element, an insulating layer with an opening for exposure, a fluorescent layer encapsulating the light-emitting element, and a transparent material on top. This design addresses the issue of non-uniform coating of phosphor powder, which is a common problem in previous techniques.

Another significant patent is "Semiconductor package and substrate structure thereof." This patent describes a substrate structure with a solder mask layer that has outwardly extended openings. When a flip-chip semiconductor chip is mounted, the underfill material effectively fills the gaps and openings, providing protection for the corners of the chip and preventing delamination during thermal cycles.

Career Highlights

Wen-Hao Lee has worked with Siliconware Precision Industries Co., Ltd., where he has contributed to various innovative projects. His expertise in semiconductor technology has made him a valuable asset in the industry.

Collaborations

Wen-Hao Lee has collaborated with notable colleagues, including Yu-Po Wang and Cheng-Hsu Hsiao, who have contributed to his innovative endeavors.

Conclusion

Wen-Hao Lee's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and improvement in the field. His work continues to influence the development of efficient and reliable electronic components.