Hsinchu, Taiwan

Wen-Chun Tu

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.5

ph-index = 1


Company Filing History:


Years Active: 2025

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3 patents (USPTO):Explore Patents

Title: Innovations of Wen-Chun Tu

Introduction

Wen-Chun Tu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patents. With a total of 3 patents, his work has had a considerable impact on the industry.

Latest Patents

Wen-Chun Tu's latest patents include a method for probe pin retrieval and a method for manufacturing probe card needles. The method for probe pin retrieval involves a series of operations where a probe head is received in a carrier. This probe head consists of an upper die, a lower die, and at least one probe pin extending from the lower die to the upper die. The process measures a first bending delta between the probe tip and the pin tip, and if this delta exceeds a certain value, the probe pin is bent using a fixture. The pin is then pushed and picked by an arm for retrieval. His second patent focuses on the manufacturing of probe card needles, detailing a method that refines a conductive body to form various needle tips through an electrolytic fluid process. This method allows for the creation of needles with different sizes, shapes, and profiles.

Career Highlights

Wen-Chun Tu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing technologies that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Wen-Chun Tu has collaborated with several talented individuals, including Ming-Cheng Hsu and Ting-Yu Chiu, who contribute to the innovative environment at their workplace.

Conclusion

Wen-Chun Tu's contributions to semiconductor technology through his patents demonstrate his expertise and commitment to innovation. His work continues to influence the industry and pave the way for future advancements.

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