Tainan, Taiwan

Wen-Chun Hou

USPTO Granted Patents = 2 

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2022-2025

Loading Chart...
2 patents (USPTO):Explore Patents

Title: The Innovations of Wen-Chun Hou in Electroplating Technology

Introduction

Wen-Chun Hou, an accomplished inventor based in Tainan, Taiwan, has made significant contributions to the field of electroplating technology. With a total of two patents to his name, his innovative work primarily focuses on the enhancement of plating apparatuses for semiconductor manufacturing.

Latest Patents

One of Wen-Chun Hou's latest patents is a plating apparatus and method specifically designed for electroplating wafers. This advanced apparatus consists of a housing that defines a plating chamber for storing a plating solution. The device features a voltage source with two terminals: the first terminal is connected to the wafer and has a first polarity, while the second terminal, which has a different polarity, is connected to an anode located within the plating chamber. Additionally, a membrane support positioned over the anode features carefully engineered apertures optimized for electroplating efficiency. In this configuration, the first and second zones of the membrane support have varying aperture-area to surface-area ratios, enhancing the electroplating process.

Career Highlights

Wen-Chun Hou's professional career is closely associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading player in the semiconductor industry known for its cutting-edge technologies. His inventive contributions have proven essential in improving manufacturing processes, particularly in the realm of wafer electroplating.

Collaborations

Throughout his career, Wen-Chun has had the pleasure of collaborating with esteemed colleagues, including Hung-San Lu and Chao-Lung Chen. These partnerships have facilitated the exchange of ideas and innovations, propelling advancements in semiconductor technologies.

Conclusion

Wen-Chun Hou stands out as a notable figure in the sphere of electroplating technology, driving innovation through his patent contributions. His work not only highlights the importance of efficiency and precision in semiconductor manufacturing but also reflects the collaborative spirit that propels technological advancement in the industry. As professionals like him continue to innovate, the future of semiconductor technology looks promising.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…