Company Filing History:
Years Active: 2020
Title: Innovations of Wen-Chueh Lo in Semiconductor Packaging
Introduction: Wen-Chueh Lo is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and structures. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.
Latest Patents: Wen-Chueh Lo holds a patent for a semiconductor package structure. This innovative package structure includes a first substrate and a second substrate on which the first substrate is disposed. Additionally, a semiconductor chip is placed on the first substrate. The design features two notches or solder receiving portions on the substrates, allowing the package structure to protrude less on the surface of the printed circuit board (PCB). This design ensures that the solders on the PCB remain stable and are not shifted by the package structure.
Career Highlights: Wen-Chueh Lo is currently employed at Everlight Electronics Co., Ltd., a company known for its advancements in electronic components and solutions. His role at Everlight has allowed him to further develop his skills and contribute to cutting-edge technologies in the semiconductor industry.
Collaborations: Throughout his career, Wen-Chueh Lo has collaborated with talented individuals such as Chih-Ming Ho and Chun-Chih Liang. These collaborations have fostered a creative environment that encourages innovation and the development of new ideas in semiconductor technology.
Conclusion: Wen-Chueh Lo's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent and work at Everlight Electronics Co., Ltd. highlight his commitment to advancing the field and improving electronic device performance.