The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Aug. 27, 2018
Everlight Electronics Co., Ltd., New Taipei, TW;
Chih-Ming Ho, New Taipei, TW;
Chun-Chih Liang, New Taipei, TW;
Ding-Hwa Cherng, New Taipei, TW;
Kuang-Mao Lu, New Taipei, TW;
Wen-Chueh Lo, New Taipei, TW;
Hao-Yu Yang, New Taipei, TW;
Chieh-Yu Kang, New Taipei, TW;
Han-Chang Pan, New Taipei, TW;
Everlight Electronics Co., Ltd., New Taipei, TW;
Abstract
A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.