Company Filing History:
Years Active: 2020
Title: Chih-Ming Ho: Innovator in Semiconductor Packaging
Introduction
Chih-Ming Ho is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and structures. His work is particularly relevant in the ever-evolving electronics industry.
Latest Patents
Chih-Ming Ho holds a patent for a semiconductor package structure. This innovative package structure includes a first substrate and a second substrate on which the first substrate is disposed. Additionally, a semiconductor chip is placed on the first substrate. The design features two notches or solder receiving portions on the substrates, allowing the package structure to protrude less on the surface of the printed circuit board (PCB). This design ensures that the solders on the PCB are not shifted by the package structure, enhancing the reliability of electronic devices.
Career Highlights
Chih-Ming Ho is associated with Everlight Electronics Co., Ltd., a leading company in the field of optoelectronics. His work at Everlight has allowed him to focus on advancing semiconductor technologies and improving packaging solutions for various applications.
Collaborations
Chih-Ming Ho has collaborated with notable colleagues, including Chun-Chih Liang and Ding-Hwa Cherng. These collaborations have contributed to the development of innovative solutions in semiconductor packaging.
Conclusion
Chih-Ming Ho's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the electronics industry. His patent for a semiconductor package structure reflects his ability to address practical challenges in technology.