Company Filing History:
Years Active: 2012-2015
Title: Innovations of Wen-Chien Fu in Light Emitting Diode Technology
Introduction
Wen-Chien Fu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of light emitting diode (LED) technology. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of LED packages.
Latest Patents
Wen-Chien Fu's latest patents include a "Light emitting diode emitter substrate with highly reflective metal bonding." This innovative package structure features a substrate with a metal layer and a light-reflective layer, designed to improve the performance of photonic devices. The design eliminates the need for bonding wires over the substrate's second side, streamlining the manufacturing process. Another patent is the "Method of forming a light emitting diode emitter substrate with highly reflective metal bonding." This method outlines a fabrication process that includes forming through silicon vias, depositing dielectric layers, and creating highly reflective bonding pads for LED and wire bonding.
Career Highlights
Wen-Chien Fu is currently employed at TSMC Solid State Lighting Ltd., where he continues to advance LED technology. His work has been instrumental in developing more efficient lighting solutions that benefit various applications.
Collaborations
Wen-Chien Fu collaborates with talented individuals such as Hsing-Kuo Hsia and Chih-Kuang Yu, contributing to a dynamic team focused on innovation in solid-state lighting.
Conclusion
Wen-Chien Fu's contributions to LED technology through his patents and work at TSMC Solid State Lighting Ltd. highlight his role as a key innovator in the field. His advancements are paving the way for more efficient lighting solutions in the future.