The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Feb. 11, 2011
Chyi Shyuan Chem, Taipei, TW;
Wen-chien Fu, Hsinchu, TW;
Hsing-kuo Hsia, Jhubei, TW;
Chih-kuang Yu, Chiayi, TW;
Ching-hua Chiu, Hsinchu, TW;
Hung-yi Kuo, Taipei, TW;
Chyi Shyuan Chem, Taipei, TW;
Wen-Chien Fu, Hsinchu, TW;
Hsing-Kuo Hsia, Jhubei, TW;
Chih-Kuang Yu, Chiayi, TW;
Ching-Hua Chiu, Hsinchu, TW;
Hung-Yi Kuo, Taipei, TW;
TSMC Solid State Lighting Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding.