TSMC Solid State Lighting Ltd.

Wen-Chien Fu

Hung-Yi Kuo

Hsing-Kuo Hsia

Chih-Kuang Yu

Ching-Hua Chiu

Chyi Shyuan Chern

Chyi Shyuan Chem

A package structure includes: a substrate having a first side and a second side opposite to the first side; a metal layer disposed over at least a portion of the second side of the substrate; a light-reflective layer disposed over the first side of the substrate; and a photonic device bonded to the light-reflective layer from the first side. A segment of the metal layer extends through the substrate from the first side to the second side, and a portion of the substrate is completely enclosed in a cross-sectional view by the metal layer. The package structure is free of a bonding wire over the second side of the substrate.

Light emitting diode emitter substrate with highly reflective metal bonding

The present disclosure provides one embodiment of a method for fabricating a light emitting diode (LED) package. The method includes forming a plurality of through silicon vias (TSVs) on a silicon substrate; depositing a dielectric layer over a first side and a second side of the silicon substrate and over sidewall surfaces of the TSVs; forming a metal layer patterned over the dielectric layer on the first side and the second side of the silicon substrate and further filling the TSVs; and forming a plurality of highly reflective bonding pads over the metal layer on the second side of the silicon substrate for LED bonding and wire bonding.

Method of forming a light emitting diode emitter substrate with highly reflective metal bonding

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Hsinchu, Taiwan

Wen-Chien Fu