Kaohsiung, Taiwan

Wen-Chi Cheng

This inventor holds 2 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2010-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Chi Cheng. Retrieved from https://idiyas.com/inventor/wen-chi-cheng-l1v7w58w

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010-2015

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2 patents (USPTO):Explore Patents

Title: Innovations of Wen-Chi Cheng

Introduction

Wen-Chi Cheng is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor substrates and leadframes.

Latest Patents

Wen-Chi Cheng's latest patents include a semiconductor substrate and a method for making the same. This invention relates to a semiconductor substrate that comprises an insulation layer, a first circuit layer, a second circuit layer, a plurality of conductive vias, and a plurality of bumps. The first circuit layer is embedded in the insulation layer and is exposed from its surface. The second circuit layer is positioned on the opposite surface and is electrically connected to the first circuit layer through the conductive vias. The bumps are strategically located on part of the first circuit layer, maintaining a lattice that corresponds with that of the first circuit layer.

Another significant patent is for a leadframe with a die pad and corresponding leads. This leadframe features a die pad designed to support a die, with multiple sides that include recess and protrusion portions. The leads are coplanar with the die pad, consisting of first and second leads that extend into the recess portions and align with the protrusion portions, respectively. This design allows for adjustable wire lengths connecting the die to the leads or die pad, ultimately reducing manufacturing costs.

Career Highlights

Wen-Chi Cheng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and cost-effective.

Collaborations

Wen-Chi Cheng collaborates with talented individuals in his field, including Chun-Che Lee and Yuan-Chang Su. These collaborations enhance the innovative processes and outcomes of their projects.

Conclusion

Wen-Chi Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor design and manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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