Changhua, Taiwan

Wen-Cheng Huang


Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014-2018

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2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Wen-Cheng Huang from Changhua, Taiwan

Introduction: Wen-Cheng Huang is a notable inventor based in Changhua, Taiwan, recognized for his contributions to the field of semiconductor technology. With a total of two patents, he has significantly impacted the methods of analyzing and optimizing interconnect processes in integrated circuits.

Latest Patents: Huang's latest patents include a "Method for Analyzing Interconnect Process Variation" and "Methods for Optimizing Conductor Patterns for ECP and CMP in Semiconductor Processing." The first patent provides a comprehensive method for analyzing parasitic resistance-capacitance (RC) elements in interconnect structures of integrated circuits (ICs). It involves generating first descriptions of these elements at different process corners, calculating sensitivity values, and simulating variations to optimize performance. The second patent focuses on optimizing the conductor patterns formed through electrochemical plating (ECP) processes, utilizing global and local effects factors to enhance semiconductor design layouts.

Career Highlights: Huang is currently affiliated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in semiconductor manufacturing. His innovative approaches have contributed to advancements in IC design and process optimization, showcasing his expertise in semiconductors.

Collaborations: During his career, Huang has collaborated with esteemed colleagues such as Chi-Feng Lin and Yu-Wei Chou, enhancing research and development efforts in their respective areas. Chou's participation showcases the valuable contributions of women in the field.

Conclusion: Wen-Cheng Huang is a distinguished inventor whose work continues to influence the semiconductor industry. His patents embody innovative problem-solving strategies that pave the way for further developments in interconnect processing and conductor pattern optimization, highlighting the importance of collaboration in driving innovation.

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