Bridgewater, NJ, United States of America

Wen B Chiao

USPTO Granted Patents = 11 

 

Average Co-Inventor Count = 1.8

ph-index = 7

Forward Citations = 292(Granted Patents)


Location History:

  • Somerville, NJ (US) (1981)
  • Piscataway, NJ (US) (1982 - 1987)
  • Bridgewater, NJ (US) (1987 - 1997)

Company Filing History:


Years Active: 1981-1997

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11 patents (USPTO):Explore Patents

Title: Innovations of Wen B Chiao

Introduction

Wen B Chiao is a notable inventor based in Bridgewater, NJ (US), recognized for his contributions to the field of adhesive technologies. With a total of 11 patents to his name, he has made significant advancements in polyurethane sealant compositions and hot melt adhesive formulations.

Latest Patents

One of his latest patents involves a polyurethane sealant composition that includes a urethane prepolymer with an isocyanate functionality of at least about 2.0 and a molecular weight of at least about 2,000. This innovative sealant is particularly effective in bonding glass to metal substrates without the need for a separate primer composition. Another significant patent focuses on acrylic modified reactive urethane hot melt adhesive compositions. This invention allows for the addition of low molecular weight polymers formed from ethylenically unsaturated monomers, which enhances the adhesive's initial cohesive strength and performance after aging.

Career Highlights

Wen B Chiao has worked with prominent companies such as National Starch and Chemical Corporation and Essex Specialty Products Inc. His experience in these organizations has contributed to his expertise in adhesive technologies and innovation.

Collaborations

Throughout his career, Chiao has collaborated with notable colleagues, including Dilip K Ray-Chaudhuri and Carmine P Iovine. These partnerships have likely fostered a creative environment that has led to the development of his patented technologies.

Conclusion

Wen B Chiao's contributions to adhesive technology through his innovative patents demonstrate his significant impact in the field. His work continues to influence the development of effective bonding solutions in various applications.

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