National Starch and Chemical Corporation

National Starch and Chemical Investment Holding Corporation

Essex Specialty Products Inc.

Honeywell International Inc.

Wen B Chiao

Dilip K Ray-Chaudhuri

Carmine P Iovine

Rakesh Vig

Samuel Gold

Jules E Schoenberg

Yen-Jer Shih

Michael Jablon

Irwin J Davis

Henry Stanley

Stephen Armstrong

John D Clay

John (Ji-Hsiung) Tsai

George S Leotsakos

Described herein is a polyurethane sealant composition comprising (1) a urethane prepolymer having an isocyanate functionality of at least about 2.0 and a molecular weight of at least about 2,000; and (2) the reaction product of a secondary amino- or mercaptoalkoxy silane and a polyisocyanate having an average of at least one silane group and at least one isocyanate group per molecule and a molecular weight of less than about 2,000. The sealant composition of the invention is particularly useful in bonding glass to metal substrates when the glass substrate has not been primed with an application of a separate primer composition prior to the application of the sealant.

Polyurethane sealant compositions

The addition to urethane prepolymers of low molecular weight polymers formed from ethylenically unsaturated monomers which do not contain active hydrogen provides a hot melt adhesive which can be readily coated at a viscosity of 3000 to 50,000 cps. at 120.degree.C. without the need for additional tackifiers or plasticizers and which has improved initial cohesive strength as well as improved strength after aging of the cured bond. In a preferred embodiment of the invention, the ethylenically unsaturated monomers are polymerized in the non-isocyanate containing components of the isocyanate terminated prepolymer.

Arcylic modified reactive urethane hot melt adhesive compositions

A self-crosslinking polymer consisting essentially of at least 1 mole % of a halohydrin monomer, at least 1 mole % of a tertiary or secondary amine salt monomer, and 0-98 mole % of a vinyl polymerizable monomer other than the halohydrin or amine salt monomers crosslinks, in the presence of a base, at a lower temperature than a polymer without the tertiary or secondary amine salt monomer. Typical polymers contain 3-chloro-2-hydroxypropyl acrylate or methacrylate; diallylamine hydrochloride, N-isopropyl methacrylamide hydrogen sulfate, dimethylaminopropyl methacrylamide, or dimethylaminoethyl methacrylate hydrochloride or acetate; and optionally other monomers such as a vinyl ester, an acrylate, or a dialkyl diallyl ammonium chloride. When the polymers contain a conductive cationic monomer such as dimethyl diallyl ammonium chloride, they are useful as electroconductive coatings for paper substrates. An adduct of epichlorohydrin and dimethylaminopropyl methacrylamide or dimethylaminoethyl methacrylate may be used in place of the 3-chloro-2-hydroxypropyl acrylate or methacrylate for the electroconductive coatings.

Electroconductive coatings

A self-crosslinking polymer consisting essentially of at least 1 mole % of a halohydrin monomer, at least 1 mole % of a tertiary or secondary amine salt monomer, and 0-98 mole % of a vinyl polymerizable monomer other than the halohydrin or amine salt monomers crosslinks, in the presence of a base, at a lower temperature than a polymer without the tertiary or secondary amine salt monomer. Typical polymers contain 3-chloro-2-hydroxypropyl acrylate or methacrylate; diallylamine hydrochloride, N-isopropyl methacrylamide hydrogen sulfate, dimethylaminopropyl methacrylamide, or dimethylaminoethyl methacrylate hydrochloride or acetate; and optionally other monomers such as a vinyl ester, an acrylate, or a dialkyl diallyl ammonium chloride. When the polymers contain a conductive cationic monomer such as dimethyl diallyl ammonium chloride, they are useful as electroconductive coatings for paper substrates. An adduct of epichlorohydrin and dimethylaminopropyl methacrylamide or dimethylaminoethyl methacrylate may be used in place of the 3-chloro-2-hydrodxypropyl acrylate or methacrylate for the electroconductive coatings.

Base-catalyzed, low temperature self-crosslinking polymers

Polysaccharide graft copolymers are prepared by a water-in-oil emulsion polymerization process in which the polysaccharide and water-soluble monomer are emulsified in an oil phase containing emulsifying agents and polymerized therein. The resultant emulsion polymers are in stable form and may be used directly, for example, as adhesives for prepasted wallpaper, or may be inverted into aqueous systems and used for their thickening or flocculating properties.

Inverse emulsions

Novel gelling agents are prepared by reacting diphenyldiisocyanates with sulfur trioxide in a molar concentration of about 1:2. When the sulfonated diphenyldiisocyanate is added to water in concentrations above 2%, a gel is produced which is stable under acidic conditions at pH levels of about 4 or less.

Novel gelling composition

Two-part anaerobic adhesives and articles bonded therewith are disclosed. The adhesives comprise a first part component of free radical initiated polymerizable acrylic monomer(s) and a diaryl iodonium salt. A second part comprises a condensation reaction product of an aldehyde and a primary or secondary amine. The described curable adhesives are formed just prior to use where the second part containing the activator is brought in contact with the first part. Both the first part and second part component exhibit a high degree of stability when stored separately.

Anaerobic adhesive compositions

Styrene and maleic anhydride monomers are copolymerized in 1,2-dichloroethane employing 3-mercaptopropionic acid or methyl-3-mercaptopropionate chain transfer agents producing an odorless copolymer in the molecular weight range of about 500 to 10,000 which remains soluble in the solvent. The resultant copolymer may be conveniently sulfonated in the 1,2-dichloroethane solvent used for the polymerization thereby producing an odorless sulfonated copolymer.

Preparation of low molecular weight styrene-maleic anhydride copolymers

Novel stable anaerobic compositions are prepared which contain, as a novel reactive thickener, a polymerizable polymeric adduct having pendant double bonds which is dissolved in a polymerizable monomeric diluent. The anaerobic compositions show improved performance properties. The thickener is prepared by reacting an anhydride-containing polymer with an excess of a C.sub.2 -C.sub.5 hydroxyalkyl acrylate or methacrylate (e.g. hydroxyethyl and hydroxypropyl methacrylate), optionally in the presence of (meth)acrylate monomers which are not reactive with the anhydride groups of the polymer and which act as an additional diluent. The polymer may be prepared by conventional free radical polymerization techniques using maleic, citraconic, and/or itaconic anhydride and an ethylenically unsaturated monomer (e.g. C.sub.1 -C.sub.10 alkyl acrylates or methacrylates or styrene).

Polymeric adducts with pendant polymerizable double bonds, their

Novel unitary, storable, heat-curable epoxy resin systems are prepared which contain a polyepoxide and a curing amount of a salt of piperazine and a C.sub.3 -C.sub.21 polycarboxylic acid. In a preferred aspect the salt is present in a stoichiometric amount. The resin system is cured into an insoluble, infusible resin product by heating thereof at a temperature greater than 50.degree. C., preferably 50.degree.-250.degree. C., for a time sufficient to complete the cure.

Curing agents for epoxy resins

A N-substituted piperazine or N-substituted homopiperazine adduct with a polyepoxide is used as a co-curing agent in epoxy resin systems containing a polyepoxide and a known curing agent such as dicyandiamide, a carboxylic acid anhydride, or a dihydrazide. The preferred adducts have a ratio of epoxy groups to secondary amino groups of between 1.2:1 and 3:1. The preferred polyepoxides are polyglycidyl ethers of 4,4'-isopropylidenediphenol (bisphenol A). Suitable adducts are prepared from N-methyl-, N-(2-hydroxyethyl)-, N-octyl-, N-phenyl- and N-benzyl piperazine and N-methyl homopiperazine.

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Bridgewater, NJ, United States of America

Wen B Chiao