Beijing, China

Weikang Wu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Peking University. Active years: 2016.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Weikang Wu: Innovator in Radiation-Hardened Technology

Introduction

Weikang Wu is a notable inventor based in Beijing, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of radiation-hardened devices. His innovative work aims to enhance the reliability of electronic components in environments exposed to radiation.

Latest Patents

Weikang Wu holds a patent for a radiation-hardened-by-design (RHBD) multi-gate device. This invention discloses a novel multi-gate device that includes a substrate, a source region, and a drain region. The device features a protruding fin structure and a field dielectric layer, along with a gate dielectric and a gate electrode. The design incorporates two isolation layers in the drain region, which are separated by an interlayer that forms a shunt PN junction. This configuration effectively reduces the sensitivity of the device to single-event irradiation, making it a significant advancement over prior art.

Career Highlights

Weikang Wu is affiliated with Peking University, where he continues to engage in research and development in semiconductor technology. His work has garnered attention for its practical applications in enhancing the durability of electronic devices in challenging environments.

Collaborations

Weikang Wu has collaborated with notable colleagues, including Ru Huang and Xia An. Their combined expertise contributes to the advancement of innovative technologies in their field.

Conclusion

Weikang Wu's contributions to radiation-hardened technology exemplify the importance of innovation in the semiconductor industry. His patent for the multi-gate device represents a significant step forward in creating more resilient electronic components.

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