This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021-2023
Title: Wei-Yu Chien: Innovator in Semiconductor Packaging Technology
Introduction
Wei-Yu Chien is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging devices. With a total of 2 patents to his name, Chien's work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
Chien's latest patents include a semiconductor packaging device that features a shield structure designed to block magnetic and electric fields between electronic components. This innovative design allows for improved functionality of components such as inductors. The device comprises a first integrated circuit (IC) chip that overlies a second IC chip, with each chip containing its own substrate and interconnect structure. The shield structure is strategically placed between the two electronic components, ensuring that they are protected from interference. This advancement is crucial for the development of more efficient and reliable semiconductor devices.
Career Highlights
Wei-Yu Chien is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to collaborate with other talented professionals and contribute to groundbreaking innovations in semiconductor technology.
Collaborations
Chien has worked alongside notable colleagues such as Chien-Hsien Tseng and Dun-Nian Yaung. Their combined expertise has fostered an environment of innovation and creativity, leading to advancements in semiconductor packaging solutions.
Conclusion
Wei-Yu Chien's contributions to semiconductor technology exemplify the importance of innovation in the electronics industry. His patents and collaborative efforts continue to shape the future of semiconductor packaging, ensuring enhanced performance and reliability for electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile