Luzhu, Taiwan

Wei-Yu Chen

This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Yu Chen. Retrieved from https://idiyas.com/inventor/wei-yu-chen-8z7s5x29

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Innovations of Wei-Yu Chen

Introduction

Wei-Yu Chen is a notable inventor based in Luzhu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent in wafer bonding methods. His work is essential for advancements in microelectronics and related industries.

Latest Patents

Wei-Yu Chen holds a patent for a wafer bonding method. This method involves several steps, including coating a medium layer on the surfaces of two wafers, removing impurities from each medium layer, laminating the two wafers with the medium layers facing each other, and applying ultrasonic oscillation and bonding pressure to achieve a strong bond between the wafers. This innovative approach enhances the efficiency and effectiveness of wafer bonding processes.

Career Highlights

Wei-Yu Chen is affiliated with the Industrial Technology Research Institute, where he continues to develop and refine his inventions. His expertise in wafer bonding has positioned him as a key figure in the semiconductor research community.

Collaborations

Some of his notable coworkers include Chun-Hao Chang and Chuan-Sheng Zhuang. Their collaborative efforts contribute to the advancement of technology in their field.

Conclusion

Wei-Yu Chen's contributions to wafer bonding methods exemplify the importance of innovation in the semiconductor industry. His work not only enhances manufacturing processes but also paves the way for future technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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