The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
May. 12, 2006
Chun-hao Chang, Fengshan, TW;
Shih-chieh Liao, Taichung, TW;
Guo-shing Huang, Tainan, TW;
Wei-yu Chen, Luzhu Shiang, TW;
Chuan-sheng Zhuang, Da-an Shiang, TW;
Chun-Hao Chang, Fengshan, TW;
Shih-Chieh Liao, Taichung, TW;
Guo-Shing Huang, Tainan, TW;
Wei-Yu Chen, Luzhu Shiang, TW;
Chuan-Sheng Zhuang, Da-an Shiang, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.