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For the Inventor, By the Inventor

Taipei, Taiwan

Wei-Wen Tsai

This inventor holds 16 USPTO granted patents. Top assignees: Rohm and Haas Electronic Materials Cmp Holdings, Inc., Rohm and Haas Company, Dow Global Technolgoies LLC. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wei-Wen Tsai. Retrieved from https://idiyas.com/inventor/wei-wen-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16

% Patents Active = 93.8

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Horsham, PA (US) (2014 - 2019)
  • Taichung, TW (2020)
  • Newark, DE (US) (2021)
  • Taipei, TW (2020 - 2022)
  • Philadelphia, PA (US) (2018 - 2023)

Company Filing History:

goldMedal12 out of 311 
 
Rohm and Haas Electronic Materials Cmp Holdings, Inc.
 patents
silverMedal3 out of 3,445 
 
Rohm and Haas Company
 patents
bronzeMedal2 out of 4,807 
 
Dow Global Technolgoies LLC
 patents
4. 1 out of 1 
 
Rohm and Haas Electronic Cmp Holdings, Inc.
 patent
where one patent can have more than one assignee

Years Active: 2014-2023

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16 patents (USPTO):Explore Patents
1. 11667061 - Method of forming leveraged poromeric polishing pad (2023-06-06),
2. 11339308 - Chemical mechanical polishing method (2022-05-24),
3. 10947415 - Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds (2021-03-16),
4. 10815392 - Chemical mechanical polishing method for tungsten (2020-10-27),
5. 10640682 - Chemical mechanical polishing method for tungsten (2020-05-05),
6. 10633558 - Chemical mechanical polishing method for tungsten (2020-04-28),
7. 10633557 - Chemical mechanical polishing method for tungsten (2020-04-28),
8. 10604678 - Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds (2020-03-31),
9. 10573524 - Method of chemical mechanical polishing a semiconductor substrate (2020-02-25),
10. 10557060 - Method of chemical mechanical polishing a substrate (2020-02-11),
11. 10286518 - Chemical mechanical polishing method for tungsten (2019-05-14),
12. 10181408 - Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives (2019-01-15),
13. 10173925 - Synthetic polymer rheology modifier and water retention agent replacement for cellulose ether in cement compositions (2019-01-08),
14. 10005694 - Two component synthetic water retention agent and rheology modifier for use in cements, mortars and plasters (2018-06-26),
15. 9984895 - Chemical mechanical polishing method for tungsten (2018-05-29),

Title: The Innovative Journey of Wei-Wen Tsai

Introduction:

Wei-Wen Tsai, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Wei-Wen Tsai's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights:

With a career spanning over two decades, Wei-Wen Tsai has worked with leading tech companies in Taiwan and Silicon Valley. He has been instrumental in developing cutting-edge solutions for various industries, ranging from healthcare to transportation.

Collaborations:

Throughout his career, Wei-Wen Tsai has collaborated with top researchers, engineers, and designers to bring his inventions to life. His collaborative efforts have led to the successful implementation of innovative technologies in real-world applications.

Conclusion:

In conclusion, Wei-Wen Tsai's passion for innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor. His contributions continue to shape the future of technology and inspire the next generation of inventors worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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