Wei-Wen Lan

Title: Wei-Wen Lan: Innovator in High Density Package Substrates

Introduction

Wei-Wen Lan is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of electronics through his innovative patents. With a total of 2 patents, Lan has focused on enhancing the efficiency and functionality of electronic components.

Latest Patents

Lan's latest patents include a "High Density Package Substrate and Method for Fabricating the Same." This invention provides a high-density package substrate that utilizes a double-sided copper clad laminate. The method involves laser drilling to create a through hole, which is then lined with a seed layer and plated to form a plated through hole (PTH). Another notable patent is the "Method for Forming a Wire Bonding Substrate." This method outlines the process of creating a substrate with conductive layers and insulating layers, allowing for effective wire bonding in electronic applications.

Career Highlights

Wei-Wen Lan is associated with Nan Ya PCB Corporation, a leading company in the printed circuit board industry. His work at Nan Ya has been instrumental in advancing the technology behind high-density substrates, which are crucial for modern electronic devices.

Collaborations

Lan has collaborated with notable coworkers, including Meng-Han Lee and Ching-Ming Chuang. Their combined expertise has contributed to the successful development of innovative solutions in the field of electronics.

Conclusion

Wei-Wen Lan's contributions to the field of electronics through his patents demonstrate his commitment to innovation. His work continues to influence the development of high-density package substrates, showcasing the importance of creativity in technology.