The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Jul. 17, 2008
Meng-han Lee, Taoyuan County, TW;
Wei-wen Lan, Taoyuan County, TW;
Ching-ming Chuang, Taoyuan County, TW;
Shi-shyan James Shang, Taoyuan County, TW;
Meng-Han Lee, Taoyuan County, TW;
Wei-Wen Lan, Taoyuan County, TW;
Ching-Ming Chuang, Taoyuan County, TW;
Shi-Shyan James Shang, Taoyuan County, TW;
Nan Ya PCB Corp., Taoyuan County, TW;
Abstract
The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).