Ching-Ming Chuang

Title: Innovations of Ching-Ming Chuang

Introduction

Ching-Ming Chuang is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of electronics through his innovative designs and methods. His work primarily focuses on high-density package substrates, which are essential in modern electronic devices.

Latest Patents

Chuang holds a patent for a "High density package substrate and method for fabricating the same." This invention provides a high-density package substrate and outlines a method for its fabrication. The design includes a double-sided copper clad laminate featuring an upper and lower copper foil. A bottom pad is strategically placed on the lower copper foil, aligned with a predetermined position of a through hole. The through hole is created by laser drilling through the upper copper foil and the substrate, while avoiding penetration through the bottom pad. A seed layer is conformally formed within the through hole, followed by the creation of a metal layer on the seed layer through plating, resulting in a plated through hole (PTH).

Career Highlights

Ching-Ming Chuang is associated with Nan Ya PCB Corporation, a leading company in the printed circuit board industry. His work at Nan Ya PCB has allowed him to apply his innovative ideas in practical applications, contributing to advancements in electronic packaging technology.

Collaborations

Chuang has collaborated with talented individuals such as Meng-Han Lee and Wei-Wen Lan. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the field.

Conclusion

Ching-Ming Chuang's contributions to the field of electronics through his innovative patents and collaborations highlight his role as a significant inventor. His work continues to influence the development of high-density package substrates, showcasing the importance of innovation in technology.