Meng-Han Lee

Title: Meng-Han Lee: Innovator in High-Density Package Substrates

Introduction

Meng-Han Lee is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of electronics through his innovative patents. With a total of 3 patents, Lee has established himself as a key figure in the development of advanced substrate technologies.

Latest Patents

One of his latest patents is titled "Supporting substrate and method for fabricating the same." This invention provides a supporting substrate that includes a substrate, a first surface metal layer with a first opening, and a second surface metal layer. The design features a through hole that exposes the second surface metal layer, along with a protective layer that has a second opening. A conductive bump is formed in the through hole, ensuring electrical connectivity.

Another notable patent is the "High density package substrate and method for fabricating the same." This invention involves a double-sided copper clad laminate with upper and lower copper foils. A bottom pad is aligned to a predetermined position of a through hole, which is created by laser drilling. A seed layer is formed within the through hole, followed by a metal layer that is plated to create a plated through hole (PTH).

Career Highlights

Meng-Han Lee is currently employed at Nan Ya PCB Corporation, where he continues to innovate in the field of printed circuit boards. His work focuses on enhancing the performance and reliability of electronic components through advanced substrate designs.

Collaborations

Lee has collaborated with notable colleagues such as Wei-Wen Lan and Shao-Yang Lu, contributing to various projects that push the boundaries of technology in the electronics industry.

Conclusion

Meng-Han Lee's contributions to the field of high-density package substrates and supporting substrates highlight his role as a leading inventor. His innovative patents reflect his commitment to advancing technology in electronics.