The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Apr. 24, 2008
Meng-han Lee, Taoyuan County, TW;
Hung-en Hsu, Taoyuan County, TW;
Wei-wen Lan, Taoyuan County, TW;
Yun-hsiang Pai, Taoyuan County, TW;
Meng-Han Lee, Taoyuan County, TW;
Hung-En Hsu, Taoyuan County, TW;
Wei-Wen Lan, Taoyuan County, TW;
Yun-Hsiang Pai, Taoyuan County, TW;
NAN YA PCB Corp., Taoyuan County, TW;
Abstract
A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.