Hung-En Hsu

Title: Innovations of Inventor Hung-En Hsu

Introduction

Hung-En Hsu is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of wire bonding substrates. His innovative approach has led to the creation of a patented method that enhances the efficiency and effectiveness of electronic components.

Latest Patents

Hung-En Hsu holds a patent for a "Method for forming a wire bonding substrate." This patent describes a process involving a substrate with a first and second surface, where a through hole is formed. A conductive layer is applied to both surfaces and the sidewall of the through hole. The conductive layer is then patterned to create conductive pads on both surfaces. An insulating layer is added, which is recessed to expose the top surfaces of the conductive pads. Finally, a first metal layer is electroplated on the first conductive pad, utilizing current from the second conductive pad through the conductive layer.

Career Highlights

Hung-En Hsu is associated with Nan Ya PCB Corp., a company known for its advancements in printed circuit board technology. His work has contributed to the company's reputation for innovation in the electronics industry. With a focus on improving manufacturing processes, Hsu's inventions play a crucial role in the development of high-performance electronic devices.

Collaborations

Hung-En Hsu has collaborated with talented coworkers, including Meng-Han Lee and Wei-Wen Lan. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Hung-En Hsu's contributions to the field of electronics through his innovative patent demonstrate his commitment to advancing technology. His work at Nan Ya PCB Corp. and collaborations with fellow inventors highlight the importance of teamwork in driving innovation.